Next Generation Cooling: Supplemental, Embedded & Chip Level

Emerson's Data Center User's Group Conference May 2008, Tampa, FL

Discover cooling strategies to cool data center loads of the future. Enabling liquid to and in the rack can achieve cooling capacities of 50kW and beyond while managing redundancy and the need for hot-swappable servers. Deploying cooling closer to the heat source is crucial.

Bala's Chuck Kensky was part of the panel of experts discussing this topic at the Data Center User's Group conference. Other panel members included experts from Sun Microsystems, Emerson Network Power, and Dell.